# GS200ALU Cerasolzer is the Lead free solder
RoHS-conform (lead free)
Description:# GS200ALU
Ø Wire:1,6 mm
Units:150gr / 1000 gr
Melting Temperature:200degree
General Information
CERASOLZER is used in manufacture of electrical parts, to contact electrical / electronical materials and flat glass / metalized glasses because it provides a unique bonding technique that can take the place of commonly used silver baking, indium soldering,molybdenum-manganese and resin (flux) bonding methods.
Glass, Ceramic, Aluminum and Stain-less Steel are commonly known as non-solderable materials with con-ventional soldering systems. Heating is not enough to overcome this obstacle.
Ultrasonic vibrations in conjunction with heat cause the required effect and delivers the technical break through.
This principle is based on the scienti-fically recognized "Ultrasonic Cavi-tational Phenomenon" which is caused by strong ultrasonic penetration.
The active-solder alloy抯 CERASOLZER together with an ultrasonic acti-vated soldering system enables to solder on 慼ard-to-solder� materials flux free.
Features
- Flux free
- Corrosion free
- Soldering temperatures between 150� - 290degree
- Wetting ability to glass + ceramics
Solderable Substrates
- Alumina
- Ceramics
- Electroconductive ITO coated glass
- Optical glasses
- Silica, Silicaglass - All kind of glasses
- Thermal conductive material
- Titanium
- Crystal, Crystalised glass
- Magnitic sintered metal
- Tantalum, Tin, Titanium
- Zync
Adhesive Mechanism
There are different targets, which can accomplished by using ultrasonic energy in a pool of molten solder on a substrate:
1. The oxides can be removed from the substrate permitting the solder to react with the substrate, i.e. bond.
2. The liquid metal can be forced into the tiny crevices, cracks and micropores of the substrate and thereby seal them and provide a greatly increased surface of the solder for bonding purposes.
3. The ultrasonic vibrat
